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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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STM32WB15CC Scheda tecnica(PDF) 116 Page - STMicroelectronics |
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STM32WB15CC Scheda tecnica(HTML) 116 Page - STMicroelectronics |
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116 / 127 page  Package information STM32WB15CC 116/127 DS13258 Rev 4 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 7.1 UFQFPN48 package information UFQFPN48 is a 48-lead, 7 x 7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package. Figure 27. UFQFPN48 outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package, it must be electrically connected to the PCB ground. A0B9_ME_V3 D Pin 1 identifier laser marking area EE D Y D2 E2 Exposed pad area Z 1 48 Detail Z R 0.125 typ. 1 48 L C 0.500x45° pin1 corner A Seating plane A1 b e ddd Detail Y T |
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