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STM32L010K4 Scheda tecnica(PDF) 82 Page - STMicroelectronics |
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STM32L010K4 Scheda tecnica(HTML) 82 Page - STMicroelectronics |
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82 / 91 page ![]() Package information STM32L010F4/K4 82/91 DS12323 Rev 3 7 Package information In order to meet environmental requirements, ST offers the STM32L010F4/K4 in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at www.st.com. ECOPACK is an ST trademark. 7.1 TSSOP20 package information Figure 28. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch, package outline 1. Drawing is not to scale. Table 60. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch, package mechanical data Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A - - 1.200 - - 0.0472 A1 0.050 - 0.150 0.0020 - 0.0059 A2 0.800 1.000 1.050 0.0315 0.0394 0.0413 b 0.190 - 0.300 0.0075 - 0.0118 c 0.090 - 0.200 0.0035 - 0.0079 D(2) 6.400 6.500 6.600 0.2520 0.2559 0.2598 E 6.200 6.400 6.600 0.2441 0.2520 0.2598 E1(3) 4.300 4.400 4.500 0.1693 0.1732 0.1772 e - 0.650 - - 0.0256 - YA_ME_V3 1 20 C c L E E1 D A2 A k e b 10 11 A1 L1 aaa SEATING PLANE C GAUGE PLANE 0.25 mm PIN 1 IDENTIFICATION |
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