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MIC5201 Scheda tecnica(PDF) 13 Page - Microchip Technology

Il numero della parte MIC5201
Spiegazioni elettronici  150 mA Low Dropout Regulator
PDF  22 Pages
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Produttore elettronici  MICROCHIP [Microchip Technology]
Homepage  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MIC5201 Scheda tecnica(HTML) 13 Page - Microchip Technology

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2017 - 2022 Microchip Technology Inc. and its subsidiaries
DS20005718D-page 13
MIC5201
4.7
Nominal Power Dissipation and
Die Temperature
The MIC5201-x.xYM at a +25°C ambient temperature
will operate reliably at up to 625 mW power dissipation
when mounted in the “worst case” manner described
above. At an ambient temperature of +55°C, the device
may safely dissipate 440 mW. These power levels are
equivalent to a die temperature of +85°C, the
recommended maximum temperature for non-military
grade silicon integrated circuits.
For MIC5201-x.xYS (SOT-223 package) heat sink
characteristics, please refer to Application Hint 17, P.C.
Board Heat Sinking.
FIGURE 4-4:
Minimum Recommended
SOIC-8 PCB Pads Size.
250 mil
30 mil
50 mil
150 mil
50 mil



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