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MIC5201 Scheda tecnica(PDF) 13 Page - Microchip Technology |
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MIC5201 Scheda tecnica(HTML) 13 Page - Microchip Technology |
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13 / 22 page ![]() 2017 - 2022 Microchip Technology Inc. and its subsidiaries DS20005718D-page 13 MIC5201 4.7 Nominal Power Dissipation and Die Temperature The MIC5201-x.xYM at a +25°C ambient temperature will operate reliably at up to 625 mW power dissipation when mounted in the “worst case” manner described above. At an ambient temperature of +55°C, the device may safely dissipate 440 mW. These power levels are equivalent to a die temperature of +85°C, the recommended maximum temperature for non-military grade silicon integrated circuits. For MIC5201-x.xYS (SOT-223 package) heat sink characteristics, please refer to Application Hint 17, P.C. Board Heat Sinking. FIGURE 4-4: Minimum Recommended SOIC-8 PCB Pads Size. 250 mil 30 mil 50 mil 150 mil 50 mil |
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