ADM7150ACPZ-3.3-R2 datasheet(22/24 Pages) AD

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ADM7150

Data Sheet

OUTLINE DIMENSIONS

2.44

2.34

2.24

TOP VIEW

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.70

1.60

1.50

0.203 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

PIN 1

INDICATOR

(R 0.15)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-229-WEED

0.20 MIN

Figure 73. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]

3 mm × 3 mm Body, Very Very Thin, Dual Lead

(CP-8-11)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MS-012-A A

1.27

0.40

1.75

1.35

2.41

0.356

0.457

4.00

3.90

3.80

6.20

6.00

5.80

5.00

4.90

4.80

0.10 MAX

0.05 NOM

3.81 REF

0.25

0.17

8°

0°

0.50

0.25

45°

COPLANARITY

0.10

1.04 REF

1.27 BSC

SEATING

PLANE

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

BOTTOM VIEW

TOP VIEW

0.51

0.31

1.65

1.25

3.098

Figure 74. 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP]

Narrow Body

(RD-8-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Output Voltage

Package Description

Package Option

Branding

ADM7150ACPZ-1.8-R2

−40°C to +125°C

1.8

8-Lead LFCSP_WD

CP-8-11

LP3

ADM7150ACPZ-3.3-R2

−40°C to +125°C

3.3

8-Lead LFCSP_WD

CP-8-11

LNA

ADM7150ACPZ-4.5-R2

−40°C to +125°C

4.5

8-Lead LFCSP_WD

CP-8-11

LNL

ADM7150ACPZ-4.8-R2

−40°C to +125°C

4.8

8-Lead LFCSP_WD

CP-8-11

LNM

ADM7150ACPZ-5.0-R2

−40°C to +125°C

5.0

8-Lead LFCSP_WD

CP-8-11

LNB

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