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MIC33030 Scheda tecnica(PDF) 5 Page - Microchip Technology |
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MIC33030 Scheda tecnica(HTML) 5 Page - Microchip Technology |
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5 / 24 page ![]() 2018 - 2022 Microchip Technology Inc. DS20006026B-page 5 MIC33030 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Junction Operating Temperature Range TJ –40 — +125 °C — Storage Temperature Range TS –65 — +150 °C — Package Thermal Resistances Thermal Resistance HJDFN 2.5 mm x 2.0 mm JA — 76 — °C/W — Thermal Resistance HJDFN 2.5 mm x 2.0 mm JC — 45 — °C/W — Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. |
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