SIP32413 datasheet(13/14 Pages) VISHAY

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Vishay Siliconix

Revison: 29-Jun-15

Document Number: 67493

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Case Outline for TDFN8 2 x 2

Note

(1) All dimensions are in millimeters which will govern.

(2) Max. package warpage is 0.05 mm.

(3) Max. allowable burrs is 0.076 mm in all directions.

(4) Pin #1 ID on top will be laser/ink marked.

(5) Dimension applies to meatlized terminal and is measured

between 0.20 mm and 0.25 mm from terminal tip.

(6) Applied only for terminals.

(7) Applied for exposed pad and terminals.

Top View

Side View

Bottom View

Pin 1 Indicator

(Optional)

(7)

(6)

0.05 C

Index Area

(D/2 x E/2)

MILLIMETERS

INCHES

DIM.

MIN.

NOM.

MAX.

MIN.

NOM.

MAX.

0.50

0.55

0.60

0.020

0.022

0.024

0.00

0.05

0.000

0.002

0.152 REF

0.006 REF

0.18

0.23

0.28

0.007

0.009

0.011

1.95

2.00

2.05

0.077

0.079

0.081

0.75

0.80

0.85

0.030

0.031

0.033

0.50 BSC

0.020 BSC

1.95

2.00

2.05

0.077

0.079

0.081

1.40

1.45

1.50

0.055

0.057

0.059

0.25

0.010

0.30

0.35

0.40

0.012

0.014

0.016

ECN: T15-0301-Rev. B, 29-Jun-15

DWG: 5997

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