MCP7940N-ESLASHMS datasheet(49/58 Pages) MICROCHIP

Il numero della parte	MCP7940N-E/MS

Spiegazioni elettronici	Battery-Backed I2C Real-Time Clock/Calendar with SRAM

PDF	58 Pages

Scroll/Zoom	100%

Produttore elettronici	MICROCHIP [Microchip Technology]

Homepage	http://www.microchip.com

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49 / 58 page

 2011-2022 Microchip Technology Inc. and its subsidiares

DS20005010J-page 49

MCP7940N

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Optional Center Pad Length

Contact Pitch

1.50

1.60

MILLIMETERS

0.50 BSC

MIN

MAX

Contact Pad Length (X8)

Contact Pad Width (X8)

0.85

0.25

Microchip Technology Drawing No. C04-129-MN Rev. B

NOM

8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN]

Contact Pad Spacing

2.90

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

ØV

SILK SCREEN

With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)

MCP7940N-E/MS Scheda tecnica(PDF) 49 Page - Microchip Technology