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USB5816C/KD Scheda tecnica(PDF) 60 Page - Microchip Technology |
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USB5816C/KD Scheda tecnica(HTML) 60 Page - Microchip Technology |
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60 / 66 page ![]() USB5816C DS00003186C-page 60 2022 Microchip Technology Inc. and its subsidiaries FIGURE 11-2: 100-VQFN PACKAGE (DIMENSIONS) For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: 1. 2. 3. Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M Sheet 2 of 2 Number of Terminals Overall Height Terminal Width Overall Width Terminal Length Exposed Pad Width Terminal Thickness Pitch Standoff Units Dimension Limits A1 A b E2 A3 e L E N 0.40 BSC 0.20 REF 7.90 0.50 0.15 0.80 0.00 0.20 0.60 8.00 0.90 0.02 12.00 BSC MILLIMETERS MIN NOM 100 8.10 0.70 0.25 1.00 0.05 MAX K 1.40 REF Terminal-to-Exposed-Pad Overall Length Exposed Pad Length D D2 CH 0.35 REF Exposed Pad Corner Chamfer 7.90 8.00 12.00 BSC 8.10 Microchip Technology Drawing C04-407-KD Rev C |
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