IPS031R datasheet(2/11 Pages) IRF

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IPS031R

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(1) Limited by junction temperature (pulsed current limited also by internal wiring)

(2) Operations at higher switching frequencies is possible. See Application. Notes.

Recommended Operating Conditions

These values are given for a quick design. For operation outside these conditions, please consult the application notes.

Symbol Parameter

Min.

Max.

Units

Vds (max) Continuous drain to source voltage

—

VIH

High level input voltage

VIL

Low level input voltage

0.5

Ids

Continuous drain current

Tamb=85

TAmbient = 85oC, IN = 5V, rth = 50oC/W, Tj = 125oC) 1" sq. footprint

—

3.3

TAmbient = 85oC, IN = 5V, rth = 100oC/W, Tj = 125oC) Std. footprint

—

Rin

Recommended resistor in series with IN pin

0.2

Ω

Tr-in(max) Max recommended rise time for IN signal (see fig. 2)

—

µS

Fr-Isc (2)

Max. frequency in short circuit condition (Vcc = 14V)

kHz

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters

are referenced to SOURCE lead. (TAmbient = 25

oC unless otherwise specified). PCB mounting uses the standard foot-

print with 70

µm copper thickness.

Symbol Parameter

Min.

Max.

Units

Test Conditions

Vds

Maximum drain to source voltage

—

Vin

Maximum input voltage

-0.3

Iin, max

Maximum IN current

-10

+10

Isd cont.

Diode max. continuous current (1)

rth=100oC/W

—

1.6

D-Pak Std footprint

rth=5oC/W

—

D-Pak with Rth=5oC/W

rth=50oC/W

—

D-Pak with sq. footprint

Isd pulsed Diode max. pulsed current (1)

—18

Maximum power dissipation

(1)

rth=50oC/W

—

2.5

rth=100oC/W

—

1.25

ESD1

Electrostatic discharge voltage (Human Body)

—

C=100pF, R=1500

Ω,

ESD2

Electrostatic discharge voltage (Machine Model)

—

0.5

C=200pF, R=0

Ω, L=10µH

T stor.

Max. storage temperature

-55

150

Tj max.

Max. junction temperature

-40

+150

Tlead

Lead temperature (soldering, 10 seconds)

—

300

Symbol Parameter

Min.

Typ.

Max. Units Test Conditions

Rth 1

Thermal resistance with standard footprint

—

100

—

Rth 2

Thermal resistance with 1" square footprint

—

Rth 3

Thermal resistance junction to case

—

Thermal Characteristics

oC/W

D-PAK

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