PPC5605BAMLL4R datasheet(41/114 Pages) NXP

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Electrical characteristics

MPC5607B Microcontroller Data Sheet, Rev. 10

NXP Semiconductors

4.5.3

Power considerations

The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using Equation 1:

TJ = TA + (PD x RθJA)

Eqn. 1

Where:

TA is the ambient temperature in °C.

RθJA is the package junction-to-ambient thermal resistance, in °C/W.

PD is the sum of PINT and PI/O (PD = PINT + PI/O).

PINT is the product of IDD and VDD, expressed in watts. This is the chip internal power.

PI/O represents the power dissipation on input and output pins; user determined.

Most of the time for the applications, PI/O< PINT and may be neglected. On the other hand, PI/O may be

significant, if the device is configured to continuously drive external modules and/or memories.

RθJB CC

Thermal resistance,

junction-to-board4

Single-layer board — 1s

100

—

°C/W

144

—

176

—

Four-layer board — 2s2p

100

—

33.6

144

—

33.4

176

—

33.4

RθJC CC

Thermal resistance,

junction-to-case5

Single-layer board — 1s

100

—

°C/W

144

—

176

—

Four-layer board — 2s2p

100

—

19.8

144

—

19.2

176

—

18.8

1 Thermal characteristics are targets based on simulation.

2 V

DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = −40 to 125 °C.

3 Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board

meets JEDEC specification for this package. When Greek letters are not available, the symbols are typed as RthJA

and RthJMA.

4 Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC

specification for the specified package. When Greek letters are not available, the symbols are typed as RthJB.

5 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate

temperature is used for the case temperature. Reported value includes the thermal resistance of the interface

layer. When Greek letters are not available, the symbols are typed as RthJC.

Table 14. LQFP thermal characteristics1 (continued)

Symbol

Parameter

Conditions2

Pin count

Value

Unit

Min Typ Max

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