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8804 Scheda tecnica(PDF) 2 Page - Shenzhen Tuofeng Semiconductor Technology Co |
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8804 Scheda tecnica(HTML) 2 Page - Shenzhen Tuofeng Semiconductor Technology Co |
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2 / 5 page ![]() www.sztuofeng.com Feb,2018 V1.0 SHENZHEN TUOFENG SEMICONDUCTOR TECHNOLOGY CO.,LTD 2 TSSOP-8 Plastic-Encapsulate MOSFETS 8804 Symbol Min Typ Max Units BVDSS 20 V 10 IGSS 10 µA BVGSO ±12 V VGS(th) 0.5 0.75 1 V ID(ON) 30 A 10 13 11.5 14 15.4 19 22.2 27 gFS 36 S VSD 0.73 1 V IS 2.4 A Ciss 1810 pF Coss 232 pF Crss 200 pF Rg 1.6 Ω Qg 17.9 nC Qgs 1.5 nC Qgd 4.7 nC tD(on) 2.5 ns tr 7.2 ns tD(off) 49 ns tf 10.8 ns trr 20.2 ns Qrr 8nC RDS(ON) Static Drain-Source On-Resistance VGS=10V, ID=8A Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge IF=8A, dI/dt=100A/µs Reverse Transfer Capacitance Turn-On Rise Time Turn-Off DelayTime VGS=10V, VDS=10V, RL=1.2Ω, RGEN=3Ω Turn-On DelayTime IF=8A, dI/dt=100A/µs SWITCHING PARAMETERS µA VGS=4.5V, VDS=5V VGS=4.5V, ID=5A Gate-Body leakage current Gate-Source Breakdown Voltage VDS=0V, IG=±250uA Gate Threshold Voltage m Ω VDS=VGS ID=250µA VDS=16V, VGS=0V VDS=0V, VGS=±10V VDS=5V, ID=8A Electrical Characteristics (TJ=25°C unless otherwise noted) STATIC PARAMETERS Parameter Conditions Drain-Source Breakdown Voltage On state drain current ID=250µA, VGS=0V IDSS Zero Gate Voltage Drain Current IS=1A,VGS=0V DYNAMIC PARAMETERS VGS=0V, VDS=10V, f=1MHz VGS=2.5V, ID=4A Maximum Body-Diode Continuous Current Input Capacitance Output Capacitance VGS=1.8V, ID=3A Forward Transconductance Diode Forward Voltage Gate resistance VGS=0V, VDS=0V, f=1MHz Turn-Off Fall Time Total Gate Charge VGS=4.5V, VDS=10V, ID=8A Gate Source Charge Gate Drain Charge A: The value of RθJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The value in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance rating. B: Repetitive rating, pulse width limited by junction temperature. C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient. D. The static characteristics in Figures 1 to 6,12,14 are obtained using <300 µs pulses, duty cycle 0.5% max. E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA curve provides a single pulse rating. Rev 4: Feb 2009 |
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