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SWCS049F Scheda tecnica(PDF) 133 Page - Texas Instruments |
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SWCS049F Scheda tecnica(HTML) 133 Page - Texas Instruments |
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133 / 144 page ![]() 133 TPS65911 www.ti.com SWCS049S – JUNE 2010 – REVISED AUGUST 2018 Submit Documentation Feedback Product Folder Links: TPS65911 Device and Documentation Support Copyright © 2010–2018, Texas Instruments Incorporated Table 8-1. Acronyms, Abbreviations, and Definitions (continued) ACRONYM OR ABBREVIATION DEFINITION SMPS Switched Mode Power Supply SPI Serial Peripheral Interface POR Power-On Reset 8.2 Documentation Support 8.2.1 Related Documentation For related documentation see the following: • Texas Instruments, CSD87330Q3D Synchronous Buck NexFET™ Power Block data sheet • Texas Instruments, Empowering Designs With Power Management IC (PMIC) for Processor Applications application report • Texas Instruments, Basic Calculation of a Buck Converter's Power Stage application report • Texas Instruments, TPS65911x Schematic Checklist • Texas Instruments, TPS65911 Layout Guidelines • Texas Instruments, TPS65911A User's Guide for 66AK2G12 Processor • Texas Instruments, TPS659114 for Freescale i.MX6 Dual/Quad User's Guide • Texas Instruments, TPS659118 User’s Guide for 66AK2G02 Processor • Texas Instruments, TPS6591133 Centaurus User Guide • Texas Instruments, TPS659113 Centaurus User Guide • Texas Instruments, TPS659112 Netra User Guide 8.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 8.4 Community Resources 8.4.1 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 8.5 Trademarks MicroStar Junior, OMAP, NexFET, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 8.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |
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