CLP

PER ROW

OPTION

OPTION

-

OTHER

OPTIONS

02 thru 50

–F

= Gold flash

on contact,

Matte Tin

on tail

–L

= 10 µ"

(0.25 µm)

Gold on

contact,

Matte Tin

on tail

–G

= 10 µ"

(0.25 µm)

Gold

(–D only)

–D

= Double

Row

–DH

= Double

Horizontal

(Requires

FTSH–04

lead style)

–BE

= Bottom Entry

(Required for bottom

entry applications)

–A

= Alignment Pin

(Not available with –PA option)

(05, 06, 07, 08, 10, 12, 15,

20, 25, 30, 40 positions only)

(–DH option and other sizes.

Contact Samtec.)

–K

= (4.00 mm) .157" DIA

Polyimide film Pick & Place Pad

(3 positions minimum)

–P

= Pick & Place Pad

(5 positions min. –D only)

(Not always necessary

for auto placement.

See Flex Processing.)

–PA

= Pick & Place Pad

with Alignment Pin

(–D only)

(Not available with –A option)

–TR

= Tape & Reel

–FR

= Full Reel Tape & Reel

(must order maximum

quantity per reel;

contact Samtec for

quantity breaks)

SPECIFICATIONS

CLP

Mates:

FTSH, FTS, FW

Insulator Material:

Black Liquid Crystal Polymer

Contact Material:

Phosphor Bronze

Plating:

Sn or Au over

50 µ" (1.27 µm) Ni

Current Rating (CLP/FTSH):

3.4 A per pin

(2 pins powered)

Voltage Rating:

280 VAC/395 VDC

Operating Temp Range:

-55 °C to +125 °C

Insertion Depth:

Top Entry =

(1.40 mm) .055" minimum

Bottom Entry =

(2.41 mm) .095" minimum

plus board thickness

DH Entry =

(2.31 mm) .091"to (2.67 mm) .105"

Normal Force:

60 grams (0.59 N) average

Max Cycles:

100 with 10 µ" (0.25 µm) Au

PROCESSING

Lead-Free Solderable:

Yes

SMT Lead Coplanarity:

(0.10 mm) .004" max (02-35)

(0.15 mm) .006" max (36-50)*

*(.004" stencil solution

may be available; contact

ipg@samtec.com)

Note:

Some lengths, styles and

options are non-standard,

non-returnable.

EXTENDED LIFE

PRODUCT

10 YEAR MFG

WITH 30 µ" GOLD

HIGH MATING

CYCLES

If odd pins/row, alignment pins are on

middle position on centerline of the part.

If even pins/row, then alignment pins are

between middle two positions.

—P OPTION

—PA OPTION

Single row

Other platings

ALSO AVAILABLE

MOQ Required

PIN/ROW

A

04-15

(3.56) .140

16-50

(7.11) .280

LOW-PROFILE

DUAL WIPE SOCKET

(1.27 mm) .050" PITCH • CLP SERIES

Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.

Gbps

8

No. of Positions x (1.27) .050 + (0.43) .017

(3.43)

.135

A

(4.57)

.180

(4.32)

.170

(2.29)

.090

—DH

—D

samtec.com?CLP

F-221 (Rev 28JUN21)