HS400x Datasheet

R36DS0022EU0103 Rev.1.03

Jun 6, 2022

Page 21

Figure 23. Read Sensor ID Command Sequence

5.

Application Circuit

Figure 24. HS400x Application Circuit (Top View)

6.

Soldering Information

This section discusses soldering considerations for the HS400x.

for use with the JEDEC J-STD-020D standard soldering profile is 260°C. For manual soldering, the contact time

must be limited to 5 seconds at up to 350°C. In either case, if solder paste is used, it is recommended to use ‘no-

clean’ solder paste to avoid the need to wash the PCB.

When a relative humidity sensor is exposed to the high heat associated with the soldering process, the sensor

element tends to dry out. To avoid an offset in the relative humidity readings, the sensor element must be

rehydrated after the soldering process. Care must also be taken when selecting the temperatures and durations

involved in the soldering process to avoid irreversibly damaging the sensor element.

The recommended soldering profile for a lead-free (RoHS-compliant) process is shown below.