ADP5585ACBZ-01-R7 datasheet(5/40 Pages) AD

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Data Sheet

ADP5585

Rev. C | Page 5 of 40

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VDD to GND

−0.3 V to +4 V

SCL, SDA, RST, INT, R0, R1, R2, R3, R4,

C0, C1, C2, C3, C4 to GND

−0.3 V to (VDD + 0.3 V)

Temperature Range

Operating (Ambient)

−40°C to +85°C1

Operating (Junction)

−40°C to +125°C

Storage

−65°C to +150°C

In applications where high power dissipation and poor thermal resistance

are present, the maximum ambient temperature may need to be derated.

Maximum ambient temperature (TA(MAX)) is dependent on the maximum

operating junction temperature (TJ (MAXOP) = 125°C), the maximum power

dissipation of the device (PD(MAX)), and the junction-to-ambient thermal

resistance of the device/package in the application (θJA), using the following

equation: TA (MAX) = TJ (MAXOP) − (θJA × PD (MAX)).

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all other voltages are

referenced to GND.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a printed circuit board (PCB) for surface-mount

packages.

Table 3.

Thermal Resistance

θJA

Unit

16-Ball WLCSP

°C/W

Maximum Power Dissipation

16-Lead LFCSP

67.154

°C/W

Maximum Power Dissipation

ESD CAUTION

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