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R5F51406BDFK30 Scheda tecnica(PDF) 2 Page - Renesas Technology Corp

Il numero della parte R5F51406BDFK30
Spiegazioni elettronici  48-MHz, 32-bit RX MCUs, on-chip FPU, 204 Coremark, up to 256-KB flash memory, up to 36 pins capacitive touch sensing unit, up to 9 comms channels, 12-bit A/D, D/A, RTC, IEC60730 compliance, 1.8-V to 5.5-V single supply, Encryption functions (optional)
PDF  118 Pages
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Produttore elettronici  RENESAS [Renesas Technology Corp]
Homepage  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

R5F51406BDFK30 Scheda tecnica(HTML) 2 Page - Renesas Technology Corp

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R01DS0379EJ0110 Rev.1.10
Page 2 of 118
Apr 20, 2022
RX140 Group
1. Overview
1.
Overview
1.1
Outline of Specifications
Table 1.1 lists the specifications, and Table 1.2 gives a comparison of the functions of the products in different
packages.
Table 1.1 is for products with the greatest number of functions, so the number of peripheral modules and channels will
differ in accordance with the package type. For details, see Table 1.2, Comparison of Functions for Different
Packages in the RX140 Group.
Table 1.1
Outline of Specifications (1/4)
Classification
Module/Function
Description
CPU
CPU
• Maximum operating frequency: 48 MHz
• 32-bit RX CPU (RX v2)
• Minimum instruction execution time: One instruction per clock cycle
• Address space: 4-Gbyte linear
• Register set
General purpose: Sixteen 32-bit registers
Control: Ten 32-bit registers
Accumulator: Two 72-bit registers
• Basic instructions: 75 (variable-length instruction format)
• Floating point instructions: 11
• DSP instructions: 23
• Addressing modes: 11
• Data arrangement
Instructions: Little endian
Data: Selectable as little endian or big endian
• On-chip 32-bit multiplier: 32-bit × 32-bit → 64-bit
• On-chip divider: 32-bit ÷ 32-bit → 32 bits
• Barrel shifter: 32 bits
FPU
• Single precision (32-bit) floating point
• Data types and exceptions in conformance with the IEEE754 standard
Memory
ROM
• Capacity: 64 K/128 K/256 Kbytes
• 32 MHz ≤: No-wait cycle access
• 32 MHz to 48 MHz: One-wait cycle access
• Programming/erasing method:
Serial programming (asynchronous serial communication), self-programming
RAM
• Capacity: 16 K/32 K/64 Kbytes
• No-wait memory access
E2 DataFlash
• Capacity: 4 K/8 Kbytes
• Number of erase/write cycles: 1,000,000 (typ.)
MCU operating mode
Single-chip mode
Clock
Clock generation circuit
• Main clock oscillator, sub-clock oscillator, low-speed on-chip oscillator, high-speed on-chip oscillator,
PLL frequency synthesizer, and IWDT-dedicated on-chip oscillator
• Oscillation stop detection: Available
• Clock frequency accuracy measurement circuit (CAC)
• Independent settings for the system clock (ICLK), peripheral module clock (PCLK), and FlashIF clock
(FCLK)
The CPU and system sections such as other bus masters run in synchronization with the system
clock (ICLK): 48 MHz (at max.)
Peripheral modules run in synchronization with the PCLKB: 32 MHz (at max.)
The flash peripheral circuit runs in synchronization with the FCLK: 48 MHz (at max.)
• ADCLK in the S12AD runs in synchronization with PCLKD: Up to 48 MHz
• The ICLK frequency can only be set to FCLK, PCLKB, or PCLKD multiplied by n (n: 1, 2, 4, 8, 16, 32,
64)
Resets
RES# pin reset, power-on reset, voltage monitoring reset, independent watchdog timer reset, and
software reset
Voltage detection
Voltage detection circuit
(LVDAb)
• When the voltage on VCC falls below the voltage detection level, an internal reset or internal interrupt
is generated.
Voltage detection circuit 0 is capable of selecting the detection voltage from 4 levels
Voltage detection circuit 1 is capable of selecting the detection voltage from 14 levels
Voltage detection circuit 2 is capable of selecting the detection voltage from 4 levels



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