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DS0147 Scheda tecnica(PDF) 117 Page - Microchip Technology

Il numero della parte DS0147
Spiegazioni elettronici  PolarFire SoC Advanced Datasheet
PDF  128 Pages
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Produttore elettronici  MICROCHIP [Microchip Technology]
Homepage  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

DS0147 Scheda tecnica(HTML) 117 Page - Microchip Technology

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Unit
Max
Typ
Min
Power-On (Cold) Reset
to Fabric and I/O Oper-
ational
ms
7.89
4.43
0.97
Time when output pins
start driving – TOUT_ACTI-
VE(cold)
6.10.6
Warm Reset to Fabric and I/Os (Low Speed) Functional
The following table specifies the minimum, typical, and maximum times from the negation of the warm
reset event until the FPGA fabric is operational and the FPGA IOs are functional for low-speed (sub-400
MHz) operation.
Table 147 • Warm Boot
Unit
Max
Typ
Min
Warm Reset to Fabric
and I/O Operational
ms
2.62
1.63
0.65
Time when input pins
start working – TIN_ACTIV-
E(warm)
ms
2.62
1.63
0.65
Time when weak pull-
ups/pull-downs are en-
abled – TPU_PD_ACTIVE-
(warm)
ms
2.65
1.66
0.68
Time when fabric is op-
erational – TFAB_READY-
(warm)
ms
2.67
1.68
0.70
Time when output pins
start driving – TOUT_ACTI-
VE(warm)
6.10.7
Miscellaneous Initialization Parameters
In the following table, TFAB_READY refers to either TFAB_READY(cold) or TFAB_READY(warm) as specified in the previous
tables, depending on whether the initialization is occurring as a result of a cold or warm reset, respectively.
Table 148 • Cold and Warm Boot
Condition
Unit
Max
Typ
Min
Symbol
Parameter
ms
0
0
0
The time from
TFAB_READY to
ready to pro-
gram through JT-
AG/SPI-Slave
ms
TPUF_OVHD
1
TPUF_OVHD
1
The time from
TFAB_READY to au-
to-update start
ms
TPUF_OVHD
1
TPUF_OVHD
1
The time from
TFAB_READY to
programming
recovery start
113
Microsemi Proprietary and Confidential. DS0147 Revision 1.0
AC Switching Characteristics



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