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TPS4100 Scheda tecnica(PDF) 7 Page - Tripath Technology Inc. |
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TPS4100 Scheda tecnica(HTML) 7 Page - Tripath Technology Inc. |
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7 / 14 page ![]() Tripath Technology, Inc. – Preliminary Technical Information 7 TPS4100 – KL/Rev. 2.5/02.05 External Components Description (Refer to the Connection Diagram) Components Description CS Supply decoupling for the power supply pins. For optimum performance, these components should be located close to the TAA4100 and returned to their respective “ground” as shown in the Application/Test Circuit. CBR Supply decoupling for the high current full-bridge supply pins. These components must be located as close to the power supply pins as possible to minimize output ringing which causes power supply overshoot. By reducing overshoot, these capacitors maximize the TAA4100 reliability. These capacitors should have good high frequency performance including low ESR and low ESL. CCP Supply decoupling for the charge pump (high side gate drive supply) circuitry. These components must be located as close to the TAA4100 as possible. DO Output diode, which is used to minimize output overshoots/undershoots on the output nodes These devices clamp the output to the low impedance node formed by the close connection of CBR. Note the connection shown in the Application/Test Circuit. The “high side” diode protects the bottom side device from excessive BVDSS due to overshoots on the output node. The “bottom side” diode protects the top side device from excessive BVDSS due to undershoots on the output node. This device must be an ultra fast rectifier capable of sustaining the entire supply range and high peak currents. CZ Zobel capacitor, which in conjunction with RZ, terminates the output filter at high frequencies. Use a high quality film capacitor capable of sustaining the ripple current caused by the switching outputs. RZ Zobel resistor, which in conjunction with CZ, terminates the output filter at high frequencies. The combination of RZ and CZ minimizes peaking of the output filter under both no load conditions or with real world loads, including loudspeakers, which usually exhibit a rising impedance with increasing frequency. Depending on the program material, the power rating of RZ may need to be adjusted. If the system requires full power operation at 20kHz then the power rating for RZ will likely need to be increased. LO Output inductor, which in conjunction with CO and CDO, demodulates (filters) the switching waveform into an audio signal. Forms a second order filter with a cutoff frequency of ) C L 2 ( 1 O TOT C f π = and a quality factor of TOT TOT L C R Q C L 2 O = where CTOT = CO || 2 * CDO. CO Output capacitor, which, in conjunction with LO, demodulates (filters) the switching waveform into an audio signal. Use a high quality film capacitor capable of sustaining the ripple current caused by the switching outputs. CDO Differential Output Capacitor. Differential noise decoupling for reduction of conducted emissions. Must be located near chassis exit point for maximum effectiveness. RFAULT Pull-up resistor for the open drain FAULT pin output. Recommended resistor value is 51k Ω. DCP Charge pump diodes. Used to generate floating supply for driving high side circuitry. Small signal diodes such as 1N4148 are recommended for these components. |
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