List of figures

Figure 1.

Block diagram .................................................................... 3

Figure 2.

Device pinout ..................................................................... 4

Figure 3.

Example of dual chip/master-slave scenario ............................................... 16

Figure 4.

TQFP128 (14X14X1.0 mm, 8.0x8.0 mm exp. pad down) package outline........................... 17

Figure 5.

TQFP128 (14X14X1.0 mm, 8.0x8.0 mm exp. pad down) PCB footprint ............................ 19

L9690

List of figures

DB4806 - Rev 2

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