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BC857BFZ Scheda tecnica(PDF) 2 Page - Diodes Incorporated

Il numero della parte BC857BFZ
Spiegazioni elettronici  45V PNP SMALL SIGNAL TRANSISTOR IN DFN0606
PDF  7 Pages
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Produttore elettronici  DIODES [Diodes Incorporated]
Homepage  http://www.diodes.com
Logo DIODES - Diodes Incorporated

BC857BFZ Scheda tecnica(HTML) 2 Page - Diodes Incorporated

  BC857BFZ Datasheet HTML 1Page - Diodes Incorporated BC857BFZ Datasheet HTML 2Page - Diodes Incorporated BC857BFZ Datasheet HTML 3Page - Diodes Incorporated BC857BFZ Datasheet HTML 4Page - Diodes Incorporated BC857BFZ Datasheet HTML 5Page - Diodes Incorporated BC857BFZ Datasheet HTML 6Page - Diodes Incorporated BC857BFZ Datasheet HTML 7Page - Diodes Incorporated  
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BC857BFZ
Document number: DS37158 Rev. 2 - 2
2 of 7
www.diodes.com
May 2015
© Diodes Incorporated
BC857BFZ
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Collector-Base Voltage
VCBO
-50
V
Collector-Emitter Voltage
VCEO
-45
V
Emitter-Base Voltage
VEBO
-6.0
V
Continuous Collector Current
IC
-100
mA
Peak Pulse Collector Current
ICM
-200
mA
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Power Dissipation
(Note 5)
PD
270
mW
(Note 6)
925
Thermal Resistance, Junction to Ambient
(Note 5)
RJA
465
°C/W
(Note 6)
135
Thermal Resistance, Junction to Lead
(Note 7)
RJL
135
°C/W
Operating and Storage and Temperature Range
TJ, TSTG
-55 to +150
°C
ESD Ratings (Note 8)
Characteristic
Symbol
Value
Unit
JEDEC Class
Electrostatic Discharge - Human Body Model
ESD HBM
4,000
V
3A
Electrostatic Discharge - Machine Model
ESD MM
200
V
B
Notes:
5. For the device mounted on minimum recommended pad layout 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured
under still air conditions whilst operating in steady state condition. The entire exposed collector pad is attached to the heatsink.
6. Same as Note 5, except the exposed collector pad is mounted on 25mm x 25mm 2oz copper.
7. Thermal resistance from junction to solder-point (on the exposed collector pad).
8. Refer to JEDEC specification JESD22-A114 and JESD22-A115.



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