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STN6N60M2 Scheda tecnica(PDF) 2 Page - STMicroelectronics |
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STN6N60M2 Scheda tecnica(HTML) 2 Page - STMicroelectronics |
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2 / 13 page ![]() 1 Electrical ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit VGS Gate-source voltage ±25 V ID (1) Drain current (continuous) at TC = 25 °C 5.5 A ID (1) Drain current (continuous) at TC = 100 °C 3.5 A IDM (2) Drain current (pulsed) 8 A PTOT Total power dissipation at TS = 25 °C 6 W dv/dt(3) Peak diode recovery voltage slope 15 V/ns dv/dt(4) MOSFET dv/dt ruggedness 50 TJ Operating junction temperature range -55 to 150 °C Tstg Storage temperature range 1. Limited by maximum junction temperature. 2. Pulse width limited by safe operating area. 3. ISD ≤ 5.5 A, di/dt = 400 A/μs; VDS(peak) < V(BR)DSS, VDD = 400 V 4. VDS ≤ 480 V Table 2. Thermal data Symbol Parameter Value Unit Rthj-S Thermal resistance junction-solder point 20 °C/W Rthj-pcb (1) Thermal resistance junction-pcb 38 °C/W 1. When mounted on 1 inch² FR-4, 2 Oz copper board. Table 3. Avalanche characteristics Symbol Parameter Value Unit IAR Avalanche current, repetitive or not repetitive (pulse width limited by Tjmax.) 0.8 A EAS Single pulse avalanche energy (starting Tj = 25 °C, ID = IAR, VDD = 50 V) 83 mJ STN6N60M2 Electrical ratings DS12926 - Rev 2 page 2/13 |
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