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CTP17 Scheda tecnica(PDF) 10 Page - CT Micro International Corporation |
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CTP17 Scheda tecnica(HTML) 10 Page - CT Micro International Corporation |
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10 / 12 page ![]() www.ct-micro.com © 2022 CT MICRO INTERNATIONAL CORPORATION Rev.2 ALL RIGHTS RESERVED. Page 10 Aug, 2022 CTP17 Series DC 4-Pin DFN DMC-Isolator® Phototransistor Optocoupler Solderability spec (follow the JEDEC standard JESD22-B102) Reflow Soldering: Immersed surface, other than the end of pin as cut-surface, must be covered by solder. Solder-Bath: More than 95% of the electrode must be covered with solder. Wave soldering (follow the JEDEC standard JESD22-A111) One time soldering is recommended within the condition of temperature. Temperature: 260+0/- 5˚C. Time: 10 sec. Preheat temperature:25 to 140˚C. Preheat time: 30 to 80 sec. Iron soldering (follow the standard MIL-STD 202G, Method 210F) Allow single lead soldering in every single process. One time soldering is recommended. Temperature: 350+±10˚C Time: 5 sec max. |
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