SRP2012TMA Series - Shielded Power Inductors

Soldering Profile

Profile Feature

Pb Free Assembly

Preheat

- Temperature Min. (Tsmin)

- Temperature Max. (Tsmax)

- Time(ts) from Tsmin to Tsmax

150 °C

200 °C

60-120 seconds

Ramp-up Rate (TL to Tp)

3 °C/second max.

Liquidous temperature (TL)

Time (tL) maintained above TL

217 °C

60-150 seconds

Peak package body temperature (Tp)

260 °C

Time within 5 °C of Actual Peak Temperature

(tp)

< 30 seconds

Ramp-Down Rate (Tp to TL)

6 °C/second max.

Time 25 °C to Peak Temperature

8 minutes max.

Specifications are subject to change without notice.

Users should verify actual device performance in their specific applications.

The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

L vs. I Charts

0.30

0.24

0.18

0.12

0.06

0

1.50

1.20

0.90

0.60

0.30

0

3.00

2.40

1.80

1.20

0.60

0

1.50

1.20

0.90

0.60

0.30

0

2.00

1.60

1.20

0.80

0.40

0

0.45

0.36

0.27

0.18

0.09

0

0.60

0.48

0.36

0.24

0.12

0

0

2

4

6

8

10

DC Current (A)

0

1.2

2.4

3.6

4.8

6.0

DC Current (A)

0

0.6

1.2

1.8

2.4

3.0

DC Current (A)

0

1

2

3

4

5

DC Current (A)

0

0.7

1.4

2.1

2.8

3.5

DC Current (A)

100

80

60

40

20

0

100

80

60

40

20

0

100

80

60

40

20

0

100

80

60

40

20

0

100

80

60

40

20

0

100

80

60

40

20

0

100

80

60

40

20

0

SRP2012TMA-R22M

SRP2012TMA-R68M

SRP2012TMA-2R2M

SRP2012TMA-1R0M

SRP2012TMA-1R5M

0

1.8

3.6

5.4

7.2

9.0

0

1.3

2.6

3.9

5.2

6.5

DC Current (A)

DC Current (A)

SRP2012TMA-R33M

SRP2012TMA-R47M

25

260

Time (Seconds)

REFLOW TIMES: 3 TIMES MAX.

PREHEAT AREA

MAX. RAMP UP RATE = 3 °C/SEC.

MAX. RAMP DOWN RATE = 6 °C/SEC.

Time 25 °C to Peak

8 Minutes Max.

TC -5 °C

200 °C

60~150

Sec.

217

150°C

60~120

Sec.

< 30 Sec.