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TLP223GAF Scheda tecnica(PDF) 12 Page - Toshiba Semiconductor |
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TLP223GAF Scheda tecnica(HTML) 12 Page - Toshiba Semiconductor |
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12 / 18 page ![]() TLP223GA,TLP223GAF 12 18. Ordering Information (Example of Item Name) Item Name TLP223GA(F TLP223GA(LF1,F TLP223GA(LF5,F TLP223GA(TP1,F TLP223GA(TP5,F TLP223GA(D4,F TLP223GA(D4LF1,F TLP223GA(D4LF5,F TLP223GA(D4TP1,F TLP223GA(D4TP5,F TLP223GAF(F TLP223GAF(LF4,F TLP223GAF(TP4,F TLP223GAF(D4,F TLP223GAF(D4LF4F TLP230GAF(D4TP4F Packaging (Note 1) TH LF1 LF5 LF1 LF5 TH LF1 LF5 LF1 LF5 TH, Wide forming LF4, Wide forming LF4, Wide forming TH, Wide forming LF4, Wide forming LF4, Wide forming VDE Option EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 Packing (MOQ) Magazine (100 pcs) Magazine (100 pcs) Magazine (100 pcs) Tape and reel (1500 pcs) Tape and reel (1500 pcs) Magazine (100 pcs) Magazine (100 pcs) Magazine (100 pcs) Tape and reel (1500 pcs) Tape and reel (1500 pcs) Magazine (100 pcs) Magazine (100 pcs) Tape and reel (1000 pcs) Magazine (100 pcs) Magazine (100 pcs) Tape and reel (1000 pcs) Note 1: TH: Through-hole, LF: Lead forming for surface mount 2022-02-02 Rev.4.0 ©2020-2022 Toshiba Electronic Devices & Storage Corporation |
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