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TDA4VE...ALZQ1 Scheda tecnica(PDF) 157 Page - Texas Instruments |
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TDA4VE...ALZQ1 Scheda tecnica(HTML) 157 Page - Texas Instruments |
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157 / 251 page ![]() 7.10.5.3 CSI-2 Note For more information, see the Camera Streaming Interface Receiver (CSI_RX_IF) chapter in the device TRM. The CSI_RX_IF deals with the processing of the pixel data coming from an external image sensor and data from memory. It is a key component for the following multimedia applications: camera viewfinder, video record, and still image capture. The CSI_RX_IF has a primary serial interface (CSI-2 port) compliant with the MIPI D-PHY RX specification v1.2 and the MIPI CSI-2 specification v1.3, with 4 differential data lanes plus 1 differential clock lane in synchronous mode, double data rate. Refer to the specification for timing details. • 2.5 Gbps (1.25 GHz) for each lane. 7.10.5.4 DDRSS For more details about features and additional description information on the device LPDDR4 Memory Interfaces, see the corresponding sections within Signal Descriptions and Detailed Description. The device has dedicated interface to LPDDR4. It supports JEDEC JESD209-4B standard compliant LPDDR4 SDRAM devices with the following features: • 32-bit data path to external SDRAM memory • Memory device capacity: Up to 8GB address space available over two chip selects (4GB per rank) • No support for byte mode LPDDR4 memories, or memories with more than 17 row address bits Table 7-31 and Figure 7-41 present switching characteristics for DDRSS. Table 7-31. Switching Characteristics for DDRSS NO. PARAMETER DDR TYPE MIN MAX UNIT 1 tc(DDR_CKP/DDR_CKN) Cycle time, DDR0_CKP and DDR0_CKN LPDDR4 0.4681 3.003 ns 1. Maximum DDR Frequency will be limited based on the specific memory type (vendor) used in a system and by PCB implementation. TI strongly recommends all designs to follow the TI LPDDR4 EVM PCB layout exactly in every detail (routing, spacing, vias/backdrill, PCB material, etc.) in order to achieve the full specified clock frequency. Refer to the Jacinto 7 DDR Board Design and Layout Guidelines for details. DDR0_CKP 1 DDR0_CKN Figure 7-41. DDRSS Memory Interface Clock Timing For more information, see DDR Subsystem (DDRSS) section in Memory Controllers chapter in the device TRM. 7.10.5.5 DSS For more details about features and additional description information on the device Display Subsystem – Video Output Ports, see the corresponding sections within Signal Descriptions and Detailed Description. Table 7-32 represents DPI timing conditions. Table 7-32. DPI Timing Conditions PARAMETER MIN MAX UNIT INPUT CONDITIONS SRI Input slew rate 1.44 26.4 V/ns www.ti.com TDA4VE-Q1, TDA4AL-Q1, TDA4VL-Q1 SPRSP62 – DECEMBER 2022 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 157 Product Folder Links: TDA4VE-Q1 TDA4AL-Q1 TDA4VL-Q1 |
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