Rev. 1.1 October 2018

www.aosmd.com

Page 3 of 9

AGD8252B1 / AGD8252B2

Pin Configuration

Pin Description

Pin Name

Pin Function

VCC

Low-Side Supply Voltage

HIN

High-Side Logic Input

LIN

Low-Side Logic Input

COM

Power Ground

LO

Low-Side Driver Output

VS

High-Side Floating Supply Offset Voltage

HO

High-Side Driver Output

VB

High-Side Floating Supply Voltage

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are

absolute values referenced to VSS, unless otherwise stated in the table.

Symbol

Parameter

Min.

Max.

Units

VCC

Low-Side Supply Voltage

-0.3

20

(1)

V

VIN

Logic Input Voltage (LIN, HIN)

VSS-0.3

VCC+0.3

VB

High-Side Floating Supply Voltage

-0.3

620

VS

High-Side Floating Supply Offset Voltage

VB-20

(1)

VB+0.3

VHO

High-Side Driver Output Voltage

VS-0.3

VB+0.3

VLO

Low-Side Driver Output Voltage

COM-0.3

VCC+0.3

COM

Power Ground

VCC-25

VCC+0.3

dVS/dt

Vs Offset Voltage Slew Rate

(2)

-

50

V/ns

PWHIN

High-Side Input Pulse Width

500

-

ns

PD

Package Power Dissipation @ TA ≤25°C

-

0.75

W

RthJA

Thermal Resistance, Junction to Ambient

-

150

°C/W

TJ

Junction Temperature

-

150

°C

TS

Storage Temperature

-55

150

TL

Solder Reflow Condition (10 seconds)

-

300

ESD

Human Body Model

2

kV

Notes:

1. An internal 20V zener diode is integrated to clamp each supply voltage.

2. Not subject of production test, verified by characterization.

LIN

HIN

VB

HO

VS

Vcc

COM

LO

4

3

2

1

5

6

7

8

Vcc

HIN

VB

HO

VS

LIN

COM

LO

4

3

2

1

5

6

7

8