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MPC860DP Scheda tecnica(PDF) 43 Page - NXP Semiconductors

Il numero della parte MPC860DP
Spiegazioni elettronici  MPC860 PowerQUICC Family Hardware Specifications
PDF  77 Pages
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Produttore elettronici  NXP [NXP Semiconductors]
Homepage  http://www.nxp.com
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MPC860DP Scheda tecnica(HTML) 43 Page - NXP Semiconductors

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MPC860 PowerQUICC Family Hardware Specifications, Rev. 10
Freescale Semiconductor
43
CPM Electrical Characteristics
11 CPM Electrical Characteristics
This section provides the AC and DC electrical specifications for the communications processor module
(CPM) of the MPC860.
11.1
PIP/PIO AC Electrical Specifications
Table 14 provides the PIP/PIO AC timings as shown in Figure 39 through Figure 43.
Figure 39. PIP Rx (Interlock Mode) Timing Diagram
Table 14. PIP/PIO Timing
Num
Characteristic
All Frequencies
Unit
Min
Max
21
Data-in setup time to STBI low
0
—
ns
22
Data-in hold time to STBI high
2.5 – t31
1 t3 = Specification 23.
—CLK
23
STBI pulse width
1.5
—
CLK
24
STBO pulse width
1 CLK – 5 ns
—
ns
25
Data-out setup time to STBO low
2
—
CLK
26
Data-out hold time from STBO high
5
—
CLK
27
STBI low to STBO low (Rx interlock)
—
2
CLK
28
STBI low to STBO high (Tx interlock)
2
—
CLK
29
Data-in setup time to clock high
15
—
ns
30
Data-in hold time from clock high
7.5
—
ns
31
Clock low to data-out valid (CPU writes data, control, or direction)
—
25
ns
DATA-IN
STBI
23
24
22
STBO
27
21



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