MPC855T datasheet(74/77 Pages) NXP

Il numero della parte	MPC855T

Spiegazioni elettronici	MPC860 PowerQUICC Family Hardware Specifications

PDF	77 Pages

Scroll/Zoom	100%

Produttore elettronici	NXP [NXP Semiconductors]

Homepage	http://www.nxp.com

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MPC860 PowerQUICC Family Hardware Specifications, Rev. 10

Freescale Semiconductor

Mechanical Data and Ordering Information

14.3

Mechanical Dimensions of the PBGA Package

Figure 77 shows the mechanical dimensions of the ZP PBGA package.

Figure 77. Mechanical Dimensions and Bottom Surface Nomenclature of the ZP PBGA Package

SIDE VIEW

BOTTOM VIEW

18X

357X

TOP VIEW

0.3 M C

0.15 M C

0.2 C

0.2

0.25 C

0.35 C

NOTE

Dimensions and tolerance per ASME Y14.5M, 1994.

Dimensions in millimeters.

Dimension b is the maximum solder ball diameter

measured parallel to data C.

DIM

MIN

MAX

MILLIMETERS

---

2.05

0.50

0.70

0.95

1.35

0.70

0.90

0.60

0.90

25.00 BSC

22.86 BSC

22.40

22.60

1.27 BSC

25.00 BSC

22.86 BSC

22.40

22.60

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