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LTC2600IGN Scheda tecnica(PDF) 13 Page - Linear Technology

Il numero della parte LTC2600IGN
Spiegazioni elettronici  Octal 16-/14-/12-Bit Rail-to-Rail DACs in 16-Lead SSOP
PDF  16 Pages
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Produttore elettronici  LINER [Linear Technology]
Homepage  http://www.linear.com
Logo LINER - Linear Technology

LTC2600IGN Scheda tecnica(HTML) 13 Page - Linear Technology

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LTC2600/LTC2610/LTC2620
2600fa
The selected DAC is powered up as its voltage output is
updated.
There is an initial delay as the DAC powers up before it
begins its usual settling behavior. If less than eight DACs
are in a powered-down state prior to the update command,
the power-up delay is 5
µs. If, on the other hand, all eight
DACs are powered down, then the master bias generation
circuit is also disabled and must be restarted. In this case,
the power-up delay is greater: 12
µs for VCC = 5V, 30µs for
VCC = 3V.
Voltage Outputs
Each of the 8 rail-to-rail amplifiers contained in these parts
has guaranteed load regulation when sourcing or sinking
up to 15mA at 5V (7.5mA at 3V).
Load regulation is a measure of the amplifier’s ability to
maintain the rated voltage accuracy over a wide range of
load conditions. The measured change in output voltage
per milliampere of forced load current change is ex-
pressed in LSB/mA.
DC output impedance is equivalent to load regulation, and
may be derived from it by simply calculating a change in
units from LSB/mA to Ohms. The amplifiers’ DC output
impedance is 0.025
Ω when driving a load well away from
the rails.
When drawing a load current from either rail, the output
voltage headroom with respect to that rail is limited by the
25
Ω typical channel resistance of the output devices; e.g.,
when sinking 1mA, the minimum output voltage = 25
Ω •
1mA = 25mV. See the graph Headroom at Rails vs Output
Current in the Typical Performance Characteristics sec-
tion.
The amplifiers are stable driving capacitive loads of up to
1000pF.
Board Layout
The excellent load regulation and DC crosstalk perfor-
mance of these devices is achieved in part by keeping
“signal” and “power” grounds separated internally and by
reducing shared internal resistance to just 0.005
Ω.
The GND pin functions both as the node to which the
reference and output voltages are referred and as a return
path for power currents in the device. Because of this,
careful thought should be given to the grounding scheme
and board layout in order to ensure rated performance.
The PC board should have separate areas for the analog
and digital sections of the circuit. This keeps digital signals
away from sensitive analog signals and facilitates the use
of separate digital and analog ground planes which have
minimal capacitive and resistive interaction with each
other.
Digital and analog ground planes should be joined at only
one point, establishing a system star ground as close to
the device’s ground pin as possible. Ideally, the analog
ground plane should be located on the component side of
the board, and should be allowed to run under the part to
shield it from noise. Analog ground should be a continu-
ous and uninterrupted plane, except for necessary lead
pads and vias, with signal traces on another layer.
The GND pin of the part should be connected to analog
ground. Resistance from the GND pin to system star
ground should be as low as possible. Resistance here will
add directly to the effective DC output impedance of the
device (typically 0.025
Ω), and will degrade DC crosstalk.
Note that the LTC2600/LTC2610/LTC2620 are no more
susceptible to these effects than other parts of their type;
on the contrary, they allow layout-based performance
improvements to shine rather than limiting attainable
performance with excessive internal resistance.
Rail-to-Rail Output Considerations
In any rail-to-rail voltage output device, the output is
limited to voltages within the supply range.
Since the analog outputs of the device cannot go below
ground, they may limit for the lowest codes as shown in
Figure 3b. Similarly, limiting can occur near full scale
when the REF pin is tied to VCC. If VREF = VCC and the DAC
full-scale error (FSE) is positive, the output for the highest
codes limits at VCC as shown in Figure 3c. No full-scale
limiting can occur if VREF is less than VCC – FSE.
Offset and linearity are defined and tested over the region
of the DAC transfer function where no output limiting can
occur.
OPERATIO



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