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MCP6V96UT-E/MS Scheda tecnica(PDF) 17 Page - Microchip Technology

Il numero della parte MCP6V96UT-E/MS
Spiegazioni elettronici  10 MHz, Zero-Drift Op Amps
PDF  52 Pages
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Produttore elettronici  MICROCHIP [Microchip Technology]
Homepage  http://www.microchip.com
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 2020 Microchip Technology Inc.
DS20006467A-page 17
MCP6V96/6U/7/9
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
3.1
Analog Outputs (VOUT, VOUTA,
VOUTB, VOUTC, VOUTD)
The analog output pins (VOUT) are low-impedance
voltage sources.
3.2
Analog Inputs (VIN+, VIN-, VINB+,
VINB-, VINC-, VINC+, VIND-, VIND+)
The noninverting and inverting inputs (VIN+, VIN-) are
high-impedance CMOS inputs with low bias currents.
3.3
Power Supply Pins (VDD, VSS)
The positive power supply (VDD) is 2.4V to 5.5V higher
than the negative power supply (VSS). For normal
operation, the other pins are between VSS and VDD.
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD will
need bypass capacitors.
3.4
Exposed Thermal Pad (EP)
There is an internal connection between the exposed
thermal pad (EP) and the VSS pin; they must be
connected to the same potential on the Printed Circuit
Board (PCB).
This pad can be connected to a PCB ground plane to
provide a larger heat sink. This improves the package
thermal resistance (θJA).
TABLE 3-1:
PIN FUNCTION TABLE
MCP6V96 MCP6V96U
MCP6V97
MCP6V99
Symbol
Description
SOT-23
SOT-23,
SC70
2 x 3 TDFN
MSOP
TSSOP
1
411
1
VOUT
Output
4
322
2
VIN-
Inverting Input
3
133
3
VIN+
Noninverting Input
5
588
4
VDD
Positive Power Supply
——
5
5
5
VINB+
Noninverting Input (Op Amp B)
——
6
6
6
VINB-
Inverting Input (Op Amp B)
——
7
7
7
VOUTB
Output (Op Amp B)
——
—
—
8
VOUTC
Output (Op Amp C)
——
—
—
9
VINC-
Inverting Input (Op Amp C)
——
—
—
10
VINC+
Noninverting Input (Op Amp C)
2
244
11
VSS
Negative Power Supply
——
—
—
12
VIND+
Noninverting Input (Op Amp D)
——
—
—
13
VIND-
Inverting Input (Op Amp D)
——
—
—
14
VOUTD
Output (Op Amp D)
—
—
9
—
—
EP
Exposed Thermal Pad (EP);
must be connected to VSS



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