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MCP6V96UT-E/MS Scheda tecnica(PDF) 17 Page - Microchip Technology |
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MCP6V96UT-E/MS Scheda tecnica(HTML) 17 Page - Microchip Technology |
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17 / 52 page ![]() 2020 Microchip Technology Inc. DS20006467A-page 17 MCP6V96/6U/7/9 3.0 PIN DESCRIPTIONS Descriptions of the pins are listed in Table 3-1. 3.1 Analog Outputs (VOUT, VOUTA, VOUTB, VOUTC, VOUTD) The analog output pins (VOUT) are low-impedance voltage sources. 3.2 Analog Inputs (VIN+, VIN-, VINB+, VINB-, VINC-, VINC+, VIND-, VIND+) The noninverting and inverting inputs (VIN+, VIN-) are high-impedance CMOS inputs with low bias currents. 3.3 Power Supply Pins (VDD, VSS) The positive power supply (VDD) is 2.4V to 5.5V higher than the negative power supply (VSS). For normal operation, the other pins are between VSS and VDD. Typically, these parts are used in a single (positive) supply configuration. In this case, VSS is connected to ground and VDD is connected to the supply. VDD will need bypass capacitors. 3.4 Exposed Thermal Pad (EP) There is an internal connection between the exposed thermal pad (EP) and the VSS pin; they must be connected to the same potential on the Printed Circuit Board (PCB). This pad can be connected to a PCB ground plane to provide a larger heat sink. This improves the package thermal resistance (θJA). TABLE 3-1: PIN FUNCTION TABLE MCP6V96 MCP6V96U MCP6V97 MCP6V99 Symbol Description SOT-23 SOT-23, SC70 2 x 3 TDFN MSOP TSSOP 1 411 1 VOUT Output 4 322 2 VIN- Inverting Input 3 133 3 VIN+ Noninverting Input 5 588 4 VDD Positive Power Supply —— 5 5 5 VINB+ Noninverting Input (Op Amp B) —— 6 6 6 VINB- Inverting Input (Op Amp B) —— 7 7 7 VOUTB Output (Op Amp B) —— — — 8 VOUTC Output (Op Amp C) —— — — 9 VINC- Inverting Input (Op Amp C) —— — — 10 VINC+ Noninverting Input (Op Amp C) 2 244 11 VSS Negative Power Supply —— — — 12 VIND+ Noninverting Input (Op Amp D) —— — — 13 VIND- Inverting Input (Op Amp D) —— — — 14 VOUTD Output (Op Amp D) — — 9 — — EP Exposed Thermal Pad (EP); must be connected to VSS |
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