INA206 datasheet(2/23 Pages) TI

2 / 23 page

INA206

INA207

INA208

SBOS360 − JULY 2006

www.ti.com

ABSOLUTE MAXIMUM RATINGS(1)

Supply Voltage, V+

18V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Current-Shunt Monitor Analog Inputs, VIN+ and VIN−:

Differential (VIN+) − (VIN−)

−18V to +18V

. . . . . . . . . . . . . . . . . .

Common-Mode(2)

−16V to +80V

. . . . . . . . . . . . . . . . . . . . . . . .

Comparator Analog Input and Reset Pins(2):

GND − 0.3V to (V+) + 0.3V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Analog Output, Out Pin(2)

GND − 0.3V to (V+) + 0.3V

. . . . . . . . . .

Comparator Output, Out Pin(2)

GND − 0.3V to 18V

. . . . . . . . . . . . .

VREF and CMP2 Delay Pin

GND − 0.3V to 10V

. . . . . . . . . . . . . . . .

Input Current Into Any Pin(2)

5mA

. . . . . . . . . . . . . . . . . . . . . . . . . .

Operating Temperature

−55

°C to +150°C

. . . . . . . . . . . . . . . . . . . . .

Storage Temperature

−65

°C to −150°C

. . . . . . . . . . . . . . . . . . . . . . .

Junction Temperature

+150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ESD Ratings:

Human Body Model (HBM)

4000V

. . . . . . . . . . . . . . . . . . . . . . .

Charged Device Model (CDM)

1000V

. . . . . . . . . . . . . . . . . . . .

(1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods

may degrade device reliability. These are stress ratings only, and

functional operation of the device at these or any other conditions

beyond those specified is not supported.

(2) This voltage may exceed the ratings shown if the current at that

pin is limited to 5mA.

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

ORDERING INFORMATION(1)

PRODUCT

GAIN

PACKAGE-

LEAD

PACKAGE

DESIGNATOR

PACKAGE

MARKING

1.2V

REF OUT

EXTERNAL

COMP1 AND

COMP2

REF INPUTS

INTERNAL

COMP1 AND

COMP2

0.6V REF

COMP2

DELAY PIN

INA206

20V/V

SO-14

INA206A

INA206

20V/V

TSSOP-14(3)

INA206A

INA206

20V/V

MSOP-10(3)

DGS

BQQ

SO-14(2)

INA207A

INA207

50V/V

TSSOP-14(3)

INA207A

INA207

50V/V

MSOP-10(3)

DGS

BQR

SO-14(2)

INA208A

INA208

100V/V

TSSOP-14(3)

INA208A

INA208

100V/V

MSOP-10(3)

DGS

BQS

(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site

at www.ti.com.

(2) Available Q4 ’06.

(3) Available Q2 ’07.

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