AD8692ARMZ-R2 datasheet(11/12 Pages) AD

11 / 12 page

AD8692

Rev. 0 | Page 11 of 12

OUTLINE DIMENSIONS

0.80

0.60

0.40

8°

0°

4.90

BSC

PIN 1

0.65 BSC

3.00

BSC

SEATING

PLANE

0.15

0.00

0.38

0.22

1.10 MAX

3.00

BSC

COPLANARITY

0.10

0.23

0.08

COMPLIANT TO JEDEC STANDARDS MO-187AA

Figure 30. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

0.25 (0.0098)

0.17 (0.0067)

1.27 (0.0500)

0.40 (0.0157)

0.50 (0.0196)

0.25 (0.0099)

× 45°

8°

0°

1.75 (0.0688)

1.35 (0.0532)

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0040)

5.00 (0.1968)

4.80 (0.1890)

4.00 (0.1574)

3.80 (0.1497)

1.27 (0.0500)

BSC

6.20 (0.2440)

5.80 (0.2284)

0.51 (0.0201)

0.31 (0.0122)

COPLANARITY

0.10

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN

COMPLIANT TO JEDEC STANDARDS MS-012AA

Figure 31. 8-Lead Standard Small Outline Package [SOIC]

(R-8)

Dimensions shown in millimeters and (inches)

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Branding

AD8692ARMZ-R21

−40°C to +125°C

8-Lead MSOP

RM-8

APA

AD8692ARMZ-REEL1

−40°C to +125°C

8-Lead MSOP

RM-8

APA

AD8692ARZ1

−40°C to +125°C

8-Lead SOIC

R-8

AD8692ARZ-REEL1

−40°C to +125°C

8-Lead SOIC

R-8

AD8692ARZ-REEL71

−40°C to +125°C

8-Lead SOIC

R-8

1 Z = Pb-free part.

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