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LM4050 Scheda tecnica(PDF) 11 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Il numero della parte LM4050
Spiegazioni elettronici  Precision Micropower Shunt Voltage Reference
PDF  15 Pages
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Produttore elettronici  NSC [National Semiconductor (TI)]
Homepage  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM4050 Scheda tecnica(HTML) 11 Page - National Semiconductor (TI)

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Functional Block Diagram
10104514
Applications Information
The LM4050 is a precision micro-power curvature-corrected
bandgap shunt voltage reference. For space critical applica-
tions, the LM4050 is available in the sub-miniature SOT-23
surface-mount package. The LM4050 has been designed for
stable operation without the need of an external capacitor
connected between the “+” pin and the “−” pin. If, however, a
bypass capacitor is used, the LM4050 remains stable. Re-
ducing design effort is the availability of several fixed reverse
breakdown voltages: 2.048V, 2.500V, 4.096V, 5.000V,
8.192V, and 10.000V. The minimum operating current in-
creases from 60 µA for the LM4050-2.0 to 100 µA for the
LM4050-10.0. All versions have a maximum operating cur-
rent of 15 mA.
LM4050s in the SOT-23 packages have a parasitic Schottky
diode between pin 2 (−) and pin 3 (Die attach interface
contact). Therefore, pin 3 of the SOT-23 package must be
left floating or connected to pin 2.
The 4.096V version allows single +5V 12-bit ADCs or DACs
to operate with an LSB equal to 1 mV. For 12-bit ADCs or
DACs that operate on supplies of 10V or greater, the 8.192V
version gives 2 mV per LSB.
The typical thermal hysteresis specification is defined as the
change in +25˚C voltage measured after thermal cycling.
The device is thermal cycled to temperature -40˚C and then
measured at 25˚C. Next the device is thermal cycled to
temperature +125˚C and again measured at 25˚C. The re-
sulting V
OUT delta shift between the 25˚C measurements is
thermal hysteresis. Thermal hysteresis is common in preci-
sion references and is induced by thermal-mechanical pack-
age stress. Changes in environmental storage temperature,
operating temperature and board mounting temperature are
all factors that can contribute to thermal hysteresis.
In a conventional shunt regulator application (Figure 1),an
external series resistor (R
S) is connected between the sup-
ply voltage and the LM4050. R
S determines the current that
flows through the load (I
L) and the LM4050 (IQ). Since load
current and supply voltage may vary, R
S should be small
enough to supply at least the maximum guaranteed I
RMIN
(spec. table) to the LM4050 even when the supply voltage is
at its minimum and the load current is at its maximum value.
When the supply voltage is at its maximum and I
L is at its
minimum, R
S should be large enough so that the current
flowing through the LM4050 is less than 15 mA.
R
S is determined by the supply voltage, (VS), the load and
operating current, (I
L and IQ), and the LM4050’s reverse
breakdown voltage, V
R.
Typical Applications
10104515
FIGURE 1. Shunt Regulator
www.national.com
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