STM32H7B0IB datasheet(190/205 Pages) STMICROELECTRONICS

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TAmax is the maximum ambient temperature in °C,

•

ΘJA is the package junction-to-ambient thermal resistance, in °C/W,

•

PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax),

•

PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip internal power.

PI/Omax represents the maximum power dissipation on output pins where:

PI/Omax = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the application.

Table 134. Thermal characteristics

Symbol

Definition

Parameter

value unit

ΘJA

Thermal resistance

junction-ambiant

Thermal resistance junction-ambient LQFP64 - 10 x 10 mm /0.5 mm

pitch

48.8

°C/W

Thermal resistance junction-ambient LQFP100 - 14 x 14 mm /0.5 mm

pitch

47.4

Thermal resistance junction-ambient LQFP144 - 20 x 20 mm /0.5 mm

pitch

Thermal resistance junction-ambient LQFP176 - 24 x 24 mm /0.5 mm

pitch

43.6

Thermal resistance junction-ambient UFBGA169 - 7 x 7 mm /0.5 mm

pitch

41.4

Thermal resistance junction-ambient UFBGA176+25 - 10 x 10 mm /0.65

mm pitch

44.4

ΘJB

Thermal resistance

junction-board

Thermal resistance junction-board LQFP64 - 10 x 10 mm /0.5 mm pitch

37.2

°C/W

Thermal resistance junction-board LQFP100 - 14 x 14 mm /0.5 mm

pitch

39.2

Thermal resistance junction-board LQFP144 - 20 x 20 mm /0.5 mm

pitch

41.3

Thermal resistance junction-board LQFP176 - 24 x 24 mm /0.5 mm

pitch

40.2

Thermal resistance junction-board UFBGA169 - 7 x 7 mm /0.5 mm pitch

15.3

Thermal resistance junction-board UFBGA176+25 - 10 x 10 mm /0.65

mm pitch

ΘJC

Thermal resistance

junction-case

Thermal resistance junction-case LQFP64 - 10 x 10 mm /0.5 mm pitch

°C/W

Thermal resistance junction-case LQFP100 - 14 x 14 mm /0.5 mm pitch

12.8

Thermal resistance junction-case LQFP144 - 20 x 20 mm /0.5 mm pitch

12.6

Thermal resistance junction-case LQFP176 - 24 x 24 mm /0.5 mm pitch

11.5

Thermal resistance junction-case UFBGA169 - 7 x 7 mm /0.5 mm pitch

19.9

Thermal resistance junction-case UFBGA176+25 - 10 x 10 mm /0.65

mm pitch

18.9

7.7.1

Reference documents

•

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air).

Available from www.jedec.org.

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For information on thermal management, refer to application note “Thermal management guidelines for

STM32 32-bit Arm Cortex MCUs applications” (AN5036) available from www.st.com.

STM32H7B0xB

Thermal characteristics

DS13196 - Rev 7

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