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TSB582 Scheda tecnica(PDF) 25 Page - STMicroelectronics |
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TSB582 Scheda tecnica(HTML) 25 Page - STMicroelectronics |
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25 / 34 page ![]() 7.1 SO8 exposed pad package information Figure 35. SO8 exposed pad package outline k Table 7. SO8 exposed pad mechanical data Symbol Dimensions (mm) Min. Typ. Max. A 1.70 A1 0.00 0.15 A2 1.25 b 0.31 0.51 c 0.17 0.25 D (1) 4.80 4.90 5.00 D1 2.09 E 5.80 6.00 6.20 E1 (2) 3.80 3.90 4.00 E2 2.09 e 1.27 L 0.40 1.27 k 0° 8° 1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 mm in total (both side). 2. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm per side. TSB582 SO8 exposed pad package information DS13378 - Rev 2 page 25/34 |
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