BA792 datasheet(3/8 Pages) PHILIPS

3 / 8 page

1996 Mar 13

Philips Semiconductors

Product speciﬁcation

Band-switching diode

BA792

ELECTRICAL CHARACTERISTICS

Tj = 25 °C unless otherwise speciﬁed.

Note

1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.

THERMAL CHARACTERISTICS

Note

1. Device mounted on a printed-circuit board measuring 11

× 25 × 1.6 mm.

SYMBOL

PARAMETER

CONDITIONS

MAX.

UNIT

forward voltage

IF = 100 mA

1.1

reverse current

VR = 20 V

VR = 20 V; Tamb =75 °C1

µA

diode capacitance

VR = 3 V; f = 1 to 100 MHz; note 1

1.1

diode forward resistance

IF = 3 mA; f = 200 MHz; note 1

0.7

Ω

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

Rth j-a

thermal resistance from junction to ambient

note 1

315

K/W

MOUNTING

Reﬂow soldering

Follow standard reflow soldering techniques to ensure

correct application of solder paste and placement of the

SOD110 package (see Fig.2).

Dimensions in mm.

Fig.2 SOD110 reflow soldering pattern.

handbook, halfpage

MGC119

,,,

3.00

1.25

1.00

,,,

Wave soldering

Before wave soldering, attach SOD110 packages to the

printed-circuit boards using a small dot of thermo-setting

epoxy or UV-curing adhesive centred between the

soldering lands (see Fig.3).

Dimensions in mm.

Fig.3 SOD110 wave soldering pattern.

handbook, halfpage

MGC126

3.40

1.25

1.10

,,,

1.10

,,,

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