HCS273MS

FN2475 Rev 3.00

Page 9 of 9

September 1995

Die Characteristics

DIE DIMENSIONS:

108 x 106 mils

METALLIZATION:

Type: AlSi

Metal Thickness: 11k

Å 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13k

Å  2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100

m x 100m

4 mils x 4 mils

Metallization Mask Layout

HCS273MS

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask

series for the HCS273 is TA14307B.

MR

(1)

Q0

(2)

D0

(3)

VCC

(20)

Q7

(19)

(18) D7

(17) D6

(16) Q6

(15) Q5

(14) D5

D1 (4)

Q1 (5)

Q2 (6)

D2 (7)

(8)

(9)

(10)

D3

Q3

GND

(11)

CP

(12)

Q4

(13)

D4