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HTMS1301FTK/AF Scheda tecnica(PDF) 3 Page - NXP Semiconductors |
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HTMS1301FTK/AF Scheda tecnica(HTML) 3 Page - NXP Semiconductors |
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3 / 44 page ![]() 184430 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet PUBLIC Rev. 3.0 — 18 March 2010 184430 3 of 44 NXP Semiconductors HITAG µ ISO 18000 transponder IC 5. Block diagram The HITAG µ ISO 18000 transponder IC require no external power supply. The contactless interface generates the power supply and the system clock via the resonant circuitry by inductive coupling to the read/write device (RWD). The interface also demodulates data transmitted from the RWD to the HITAG µ ISO 18000 transponder IC, and modulates the magnetic field for data transmission from the HITAG µ ISO 18000 transponder IC to the RWD. Data are stored in a non-volatile memory (EEPROM). The EEPROM has a capacity of 1760 bit and is organized in blocks. Fig 1. Block diagram of HITAG µ ISO 18000 transponder IC 001aai334 CLK MOD DEMOD VREG VDD data in data out clock R/W ANALOGUE RF INTERFACE PAD PAD RECT Cres DIGITAL CONTROL TRANSPONDER ANTICOLLISION READ/WRITE CONTROL ACCESS CONTROL EEPROM INTERFACE CONTROL RF INTERFACE CONTROL EEPROM SEQUENCER CHARGE PUMP |
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