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BAS216 Scheda tecnica(PDF) 7 Page - NXP Semiconductors |
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BAS216 Scheda tecnica(HTML) 7 Page - NXP Semiconductors |
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7 / 12 page ![]() 1999 Apr 22 7 Philips Semiconductors Product specification High-speed switching diode BAS216 MOUNTING Reflow soldering Follow standard reflow soldering techniques to ensure correct application of solder paste and placement of the SOD110 package (see Fig.9). Dimensions in mm. Fig.9 SOD110 reflow soldering pattern. handbook, halfpage MGC119 ,, ,, ,,, ,,, 3.00 1.25 1.00 1.00 ,, ,, ,,, ,,, Wave soldering Before wave soldering, attach SOD110 packages to the printed-circuit boards using a small dot of thermo-setting epoxy or UV-curing adhesive centred between the soldering lands (see Fig.10). Dimensions in mm. Fig.10 SOD110 wave soldering pattern. handbook, halfpage MGC126 ,, ,, 3.40 1.25 1.10 ,, ,, ,,, ,,, 1.10 ,,, ,,, |
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