7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VS

Supply voltage on VS+, VS– pins; VS = (VS+) – (VS–)

0

40

V

VSOUT

Supply voltage on LVDD, LVSS pins; VSOUT = VLVDD – VLVSS

0

40

V

Voltage on power pins LVDD, LVSS

(VS–) – 0.5

(VS+) + 0.5

V

VIN

Voltage on signal-input pins IN+, IN–

(VS–) – 40

(VS+) + 40

V

DGND, FDA_IN+, FDA_IN– pin voltage

(VS–) – 0.5

(VS+) + 0.5

V

Voltage on gain-select pins A2, A1, A0

VDGND – 0.5

(VS+) + 0.5

V

VO

Signal output pins maximum voltage on OUT+, OUT–

VLVSS – 0.5

VLVDD + 0.5

V

VOCM

Output common-mode voltage

VLVSS – 0.5

VLVDD + 0.5

V

IO

Signal-output pins current

–100

100

mA

ISC

Output short-circuit current((2))

Continuous

TA

Operating temperature

–50

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

Short-circuit to VSOUT / 2.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001((1))

±2000

V

Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002((2))

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VS

Input stage supply voltage

Single supply

8

36

V

Dual supply

±4

±18

VSOUT

Output stage supply voltage

Single supply

4.5

36

V

Dual supply

±2.25

±18

TA

Specified temperature

–40

125

°C

7.4 Thermal Information

THERMAL METRIC(1)

PGA855

UNIT

RGT (VQFN)

16 PINS

RθJA

Junction-to-ambient thermal resistance

47.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

53.6

°C/W

RθJB

Junction-to-board thermal resistance

22.0

°C/W

ψJT

Junction-to-top characterization parameter

1.4

°C/W

ψJB

Junction-to-board characterization parameter

22.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

7.8

°C/W

(1)

For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

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PGA855

SBOSAE0 – APRIL 2023

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