HC705MC4GRSSLASHD datasheet(175/180 Pages) NXP

Il numero della parte	HC705MC4GRS/D

Spiegazioni elettronici	General Release Specification

PDF	180 Pages

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175 / 180 page

General Release Specification

Mechanical Specifications

General Release Specification — MC68HC705MC4

Section 15. Mechanical Specifications

15.1 Contents

15.2

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .175

15.3

Plastic Dual In-Line Package (Case 710) . . . . . . . . . . . . . . . .176

15.4

Small Outline Integrated Circuit (Case 751F) . . . . . . . . . . . . .176

15.2 Introduction

The MC68HC705MC4 is available in both a 28-pin plastic dual in-line

package (PDIP) and a small outline integrated circuit (SOIC) package.

The following figures show the latest packages at the time of this

publication. To make sure that you have the latest package

specifications, contact one of the following:

•

Local Freescale Sales Office

•

Worldwide Web http://www.freescale.com

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

HC705MC4GRS/D Scheda tecnica(PDF) 175 Page - NXP Semiconductors