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PowerPC 602 RISC Microprocessor Hardware Specifications

1.6 Package Description

The following sections provide the package parameters and the mechanical dimensions for the 602. Note

that the 602 is currently offered in PQFP packages—the Motorola PQFP and the IBM PQFP.

1.6.1 Motorola Wire-Bond PQFP Package Description

The following sections provide the package parameters and mechanical dimensions for the Motorola wire-

bond PQFP package.

1.6.1.1 Package Parameters

The package parameters are as provided in the following list. The package type is mm x mm, 144-pin plastic

quad flat pack.

Package outline

28 mm x 28 mm

Interconnects

144

Pitch

0.65 mm

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com