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LP2985 Scheda tecnica(PDF) 22 Page - Texas Instruments |
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LP2985 Scheda tecnica(HTML) 22 Page - Texas Instruments |
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22 / 41 page ![]() the junction temperature. Use the junction-to-board characterization parameter (ψJB) with the PCB surface temperature 1 mm from the device package (TB) to calculate the junction temperature. TJ = TT + ψJT × PD (4) where: • PD is the dissipated power • TT is the temperature at the center-top of the device package TJ = TB + ψJB × PD (5) where: • TB is the PCB surface temperature measured 1 mm from the device package and centered on the package edge For detailed information on the thermal metrics and how to use them, see the Semiconductor and IC Package Thermal Metrics application note. LP2985 SLVS522Q – JULY 2004 – REVISED DECEMBER 2022 www.ti.com 22 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LP2985 |
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