ADP1710AUJZ-R7 datasheet(12/16 Pages) AD

12 / 16 page

ADP1710/ADP1711

Rev. 0 | Page 12 of 16

140

0.5

5.0

VIN – VOUT (V)

120

100

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

1mA

10mA

30mA

80mA

100mA

125mA

150mA

(LOAD CURRENT)

MAX TJ (DO NOT OPERATE ABOVE THIS POINT)

Figure 26. 500 mm2 of PCB Copper, TA = 50°C

140

0.5

5.0

VIN – VOUT (V)

120

100

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

1mA

10mA

30mA

80mA

100mA

125mA

150mA

(LOAD CURRENT)

MAX TJ (DO NOT OPERATE ABOVE THIS POINT)

Figure 27. 100 mm2 of PCB Copper, TA = 50°C

140

0.5

5.0

VIN – VOUT (V)

120

100

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

1mA

10mA

30mA

80mA

100mA

125mA

150mA

(LOAD CURRENT)

MAX TJ (DO NOT OPERATE ABOVE THIS POINT)

Figure 28. 0 mm2 of PCB Copper, TA = 50°C

PRINTED CIRCUIT BOARD LAYOUT

CONSIDERATIONS

Heat dissipation from the package can be improved by increasing

the amount of copper attached to the pins of the ADP1710/

ADP1711. However, as can be seen from Table 5, a point of

diminishing returns eventually is reached, beyond which an

increase in the copper size does not yield significant heat

dissipation benefits.

Place the input capacitor as close as possible to the IN and GND

pins. Place the output capacitor as close as possible to the OUT

and GND pins. For ADP1711, place the internal reference

bypass capacitor as close as possible to the BYP pin. Use of 0402

or 0603 size capacitors and resistors achieves the smallest

possible footprint solution on boards where area is limited.

GND (BOTTOM)

GND (TOP)

ADP1710/

ADP1711

OUT

Figure 29. Example PCB Layout

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