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BSP030 Scheda tecnica(PDF) 3 Page - NXP Semiconductors |
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BSP030 Scheda tecnica(HTML) 3 Page - NXP Semiconductors |
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3 / 12 page ![]() 1997 Mar 13 3 Philips Semiconductors Product specification N-channel enhancement mode vertical D-MOS transistor BSP030 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). Notes 1. Ts is the temperature at the soldering point of the drain lead. 2. Pulse width and duty cycle limited by maximum junction temperature. 3. Value based on printed-circuit board with a Rth a-tp (ambient to tie-point) of 27.5 K/W. 4. Value based on printed-circuit board with a Rth a-tp (ambient to tie-point) of 90 K/W. THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDS drain-source voltage (DC) − 30 V VGS gate-source voltage (DC) −±20 V ID drain current (DC) Ts = 100 °C; note 1 − 10 A IDM peak drain current note 2 − 40 A Ptot total power dissipation Ts = 100 °C − 5W Tamb =25 °C; note 3 − 3.3 W Tamb =25 °C; note 4 − 1.25 W Tstg storage temperature −65 +150 °C Tj operating junction temperature −65 +150 °C Source-drain diode IS source current (DC) Ts = 100 °C − 5A ISM peak pulsed source current note 2 − 20 A SYMBOL PARAMETER VALUE UNIT Rth j-s thermal resistance from junction to soldering point 10 K/W |
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