AD8159

Rev. A | Page 22 of 24

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MS-026-AED-HD

1

25

26

50

76

100

75

51

14.00 BSC SQ

16.00 BSC SQ

0.75

0.60

0.45

1.20

MAX

1.05

1.00

0.95

0.20

0.09

0.08 MAX

COPLANARITY

VIEW A

SEATING

PLANE

0° MIN

7°

3.5°

0°

0.15

0.05

VIEW A

PIN 1

TOP VIEW

(PINS DOWN)

0.27

0.22

0.17

0.50 BSC

LEAD PITCH

1

25

26

50

76

100

75

51

BOTTOM VIEW

(PINS UP)

5.00 SQ

EXPOSED

PAD

NOTES

1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.

2. THE AD8159 HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF

THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF

TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE

DEVICE WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.

Figure 45. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]

(SV-100-4)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

AD8159ASVZ

−40°C to +85°C

100-Lead TQFP_EP

SV-100-4

1

AD8159-EVAL-DC

−40°C to +85°C

DC-Coupled Evaluation Board

AD8159-EVAL-AC

−40°C to +85°C

AC-Coupled Evaluation Board