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ICS553MIT Scheda tecnica(PDF) 5 Page - Integrated Circuit Systems

Il numero della parte ICS553MIT
Spiegazioni elettronici  LOW SKEW 1 TO 4 CLOCK BUFFER
PDF  6 Pages
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Produttore elettronici  ICST [Integrated Circuit Systems]
Homepage  http://www.icst.com
Logo ICST - Integrated Circuit Systems

ICS553MIT Scheda tecnica(HTML) 5 Page - Integrated Circuit Systems

  ICS553MIT Datasheet HTML 1Page - Integrated Circuit Systems ICS553MIT Datasheet HTML 2Page - Integrated Circuit Systems ICS553MIT Datasheet HTML 3Page - Integrated Circuit Systems ICS553MIT Datasheet HTML 4Page - Integrated Circuit Systems ICS553MIT Datasheet HTML 5Page - Integrated Circuit Systems ICS553MIT Datasheet HTML 6Page - Integrated Circuit Systems  
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LOW SKEW 1 TO 4 CLOCK BUFFER
MDS 553 H
5
Revision 080404
In te gr ated Circuit Systems ● 525 Ra ce Street, San Jose, CA 9512 6 ● tel (4 08) 295-9 800 ● www.icst.com
ICS553
AC Electrical Characteristics
VDD = 2.5V ±5%, Ambient Temperature -40 to +85 °C, unless stated otherwise
VDD = 3.3V ±5%, Ambient Temperature -40 to +85 °C, unless stated otherwise
VDD = 5V ±5%, Ambient Temperature -40 to +85 °C, unless stated otherwise
Notes: 1. With rail to rail input clock
2. Between any 2 outputs with equal loading.
3. Duty cycle on outputs will match incoming clock duty cycle. Consult ICS for tight duty cycle clock
generators.
Thermal Characteristics
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Input Frequency
0
200
MHz
Output Rise Time
tOR
0.8 to 2.0V, CL=15pF
1.0
1.5
ns
Output Fall Time
tOF
2.0 to 0.8V, CL=15pF
1.0
1.5
ns
Propagation Delay
Note 1
2.2
3
5
ns
Output to output skew
Note 2
Rising edges at VDD/2
0
50
ps
Device to device skew
Rising edges at VDD/2
500
ps
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Input Frequency
0
200
MHz
Output Rise Time
tOR
0.8 to 2.0V, CL=15pF
0.6
1.0
ns
Output Fall Time
tOF
2.0 to 0.8V, CL=15pF
0.6
1.0
ns
Propagation Delay
Note 1
2.0
2.4
4
ns
Output to output skew
Note 2
Rising edges at VDD/2
0
50
ps
Device to device skew
Rising edges at VDD/2
500
ps
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Input Frequency
0
200
MHz
Output Rise Time
tOR
0.8 to 2.0V, CL=15pF
0.3
0.7
ns
Output Fall Time
tOF
2.0 to 0.8V, CL=15pF
0.3
0.7
ns
Propagation Delay
Note 1
1.8
2.5
4
ns
Output to output skew
Note 2
Rising edges at VDD/2
0
50
ps
Device to device skew
Rising edges at VDD/2
500
ps
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Thermal Resistance Junction to
Ambient
θ
JA
Still air
150
°C/W
θ
JA
1 m/s air flow
140
°C/W
θ
JA
3 m/s air flow
120
°C/W
Thermal Resistance Junction to Case
θ
JC
40
°C/W



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