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MF8 Scheda tecnica(PDF) 3 Page - National Semiconductor (TI) |
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MF8 Scheda tecnica(HTML) 3 Page - National Semiconductor (TI) |
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3 / 24 page ![]() Op Amp Electrical Characteristics The following specifications apply for Va ea5V Vb eb5V and no load on the Op Amp output unless otherwise specified Boldface limits apply for TMIN to TMAX all other limits TA e TJ e 25 C MF8CCN MF8CCJ Symbol Parameter Conditions Typical Tested Design Typical Tested Design Units Limit Limit Limit Limit (Note 9) (Note 10) (Note 11) (Note 9) (Note 10) (Note 11) VOS Maximum Input Offset Voltage g 8 g 20 g 8 g 20 mV IB Maximum Input Bias Current 10 10 pA VOUT Minimum Output Voltage Swing RLOAD e 5kX g 35 g 35 V AVOL Open Loop Gain 80 80 dB GBW Gain Bandwidth 18 18 MHz Product SR Slew Rate 10 10 V ms Logic Input and Output Characteristics The following specifications apply for Va ea10V and Vb e 0V unless otherwise specified Boldface limits apply for TMIN to TMAX all other limits TA e TJ e 25 C MF8CCN MF8CCJ Symbol Parameter Conditions Typical Tested Design Typical Tested Design Units Limit Limit Limit Limit (Note 9) (Note 10 (Note 11) (Note 9) (Note 10) (Note 11) VTa Positive Threshold Min VS e Vab Vb referred 07VS 058VS 07VS 058VS V Voltage on pin 8 Max to Vb e 0V (Note 8) 07VS 089VS 07VS 089VS V VTb Negative Threshold Min VS e Va b Vb referred 035VS 011VS 035VS 011VS V Voltage on pin 8 Max to Vb e 0V (Note 8) 035VS 047VS 035VS 047VS V VOH Output Voltage on Min High IO eb10 mA 90 90 90 V VOL pin 9 (Note 12) Max Low IO ea10 mA 10 10 10 V IOH Output Current on Min Source Pin 9 tied to Vb 60 30 60 30 mA IOL pin 9 Min Sink Pin 9 tied to Va 50 25 50 25 mA VIH Input Voltage on Min High 70 90 70 90 V VIL pins 1 2 3 10 Max Low 30 10 30 10 V 17 18 (Note 12) IIN Input Current on pins 1 2 10 10 10 m A 3 7 8 10 17 18 VIH Input Voltage on Min High Va ea10V Vb e 0V or 20 20 20 V VIL pin 7 Max Low Va ea5V Vb eb5V 08 08 08 V Note 1 Absolute Maximum Raings indicate limits beyond which damage to the device may occur DC and AC electrical specifications do not apply when operating the device beyond its specified operating conditions Note 2 When the applied voltage at any pin falls outside the power supply voltages (VIN k Vb or VIN l Va) the absolute value of current at that pin should be limited to 1 mA or less Note 3 The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX HJA and the ambient temperature TA The maximum allowable power dissipation at any temperature is PD e (TJMAX b TA) HJA or the number given in the Absolute Maximum Ratings whichever is lower For this device TJMAX e 125 C and the typical junction-to-ambient thermal resistance of the MF8CCN when board mounted is 50 CW For the MF8CCJ this number increases to 65 CW Note 4 The center frequency of each 2nd-order filter section is defined as the frequency where the phase shift through the filter is zero Note 5 Q is defined as the measured center frequency divided by the measured bandwidth where the bandwidth is the difference between the two frequencies where the gain is 3 dB less than the gain measured at the center frequency Note 6 Dynamic range is defined as the ratio of the tested minimum output swing of 269 Vrms (g38V peak-to-peak) to the wideband noise over a 20 kHz bandwidth For Qs of 1 or less the dynamic range and output swing will degrade because the gain at an internal node is 2Q Keeping the input signal level below 123xQ Vrms will avoid distortion in this case 3 |
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