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MCP621ST-E/OT Scheda tecnica(PDF) 6 Page - Microchip Technology

Il numero della parte MCP621ST-E/OT
Spiegazioni elettronici  20 MHz, 200 μV Op Amps with mCal
PDF  68 Pages
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Produttore elettronici  MICROCHIP [Microchip Technology]
Homepage  http://www.microchip.com
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MCP621ST-E/OT Scheda tecnica(HTML) 6 Page - Microchip Technology

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MCP621/1S/2/3/4/5/9
DS20002188E-page 6
 2009-2021 Microchip Technology Inc. and its subsidiaries
1.3
Timing Diagram
FIGURE 1-1:
Timing Diagram.
TABLE 1-4:
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, all limits are specified for: VDD = +2.5V to +5.5V,VSS = GND.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Temperature Ranges
Specified Temperature Range
TA
-40
+125
°C
Operating Temperature Range
TA
-40
+125
°C
(Note 1)
Storage Temperature Range
TA
-65
+150
°C
Thermal Package Resistances
Thermal Resistance, 5L-SOT-23
θJA
220.7
°C/W
Thermal Resistance, 6L-SOT-23
θJA
190.5
°C/W
Thermal Resistance, 8L-2x3 TDFN
θJA
—52.5
°C/W
Thermal Resistance, 8L-3x3 DFN
θJA
—56.7
°C/W (Note 2)
Thermal Resistance, 8L-SOIC
θJA
149.5
°C/W
Thermal Resistance, 10L-3x3 DFN
θJA
—53.3
°C/W (Note 2)
Thermal Resistance, 10L-MSOP
θJA
—202
°C/W
Thermal Resistance, 14L-SOIC
θJA
—95.3
°C/W
Thermal Resistance, 14L-TSSOP
θJA
—100
°C/W
Thermal Resistance, 16L-4x4-QFN
θJA
—45.7
°C/W (Note 2)
Note 1: Operation must not cause TJ to exceed the Maximum Junction Temperature specification (150°C).
2: Measured on a standard JC51-7, four-layer printed circuit board with ground plane and vias.
High Z
VDD
VOUT
-3 µA (typical)
High Z
ISS
ICS
-3 µA (typical)
-2.5 mA (typical)
VPRH
VPRL
tPON
tPOFF
On
0nA (typical)
High Z
-3 µA (typical)
-2.5 mA (typical)
tCOFF
tCON
On
0.7 µA (typical)
0nA (typical)
CAL/CS
VIH
VIL
tCSU
Note:
For the MCP625 dual and the MCP629 quad, there is an additional constraint on toggling the two
CAL/CS pins close together; see the TCON specification in Table 1-3.



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