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LXT971ABC Scheda tecnica(PDF) 88 Page - Intel Corporation

Il numero della parte LXT971ABC
Spiegazioni elettronici  3.3V Dual-Speed Fast Ethernet PHY Transceiver
PDF  90 Pages
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Produttore elettronici  INTEL [Intel Corporation]
Homepage  http://www.intel.com
Logo INTEL - Intel Corporation

LXT971ABC Scheda tecnica(HTML) 88 Page - Intel Corporation

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LXT971A 3.3V Dual-Speed Fast Ethernet Transceiver
88
Datasheet
Document #: 249414
Revision #: 002
Rev. Date: August 7, 2002
7.0
Package Specifications
Figure 43. PBGA Package Specification
1.26 ± 0.10
0.70 ± 0.025
0.26 ± 0.04
0.28 ± 0.10
3
SEATING PLANE
SIDE VIEW
TOP VIEW
BOTTOM VIEW
OPTION:
PIN A1 IDENTIFIER
1.00 ± 0.10
INK OR LASER MARKING
C
7.00 ± 0.20
B
2.00 REF.
0.20 (4X)
NOTES:
1. All dimensions and tolerances conform to ASME Y 14.5 M - 1994.
2. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
3. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
4. Maximum mold to substrate offset shall be 0.127.
5. The surface finish of the package shall be EDM Charmille #18 - #21.
6. Unless otherwise specified tolerance: Decimal ± 0.05 Angular ±2°.
B
H
G
F
E
D
C
A
87
6
5
43
2
1
2
0.70 REF.
6.30
0.80
0.40 ± 0.15
0.30
0.15
C
C
B
A
64-Ball Plastic Ball Grid Array Package
• Part Number - LXT971ABC Commercial Temperature Range (0ºC to +70ºC)
• Part Number - LXT971ABE Extended Temperature Range (-40ºC to +85ºC)



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